MC-301 Profilable Batch Reflow Oven w/ Android Operating System
Posted On July 11, 2018
Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer. You can view more Manncorp reflow oven at http://www.manncorp.com/smt/cat-57-1/reflow-ovens.html
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Brand : Manncorp
Manufacturer : Manncorp
MPN : 20
Part Number : 20
Publisher : Manncorp
- Programmable, controlled reflow, consistent with solder paste manufacturers’ recommended profiles, in a small benchtop system
- Exclusive Android-based software drives heater control circuitry for precise, high-speed temperature control
- Microprocessor-controlled, multi-channel PID zone temperature control stabilizes temperature over 9.84″ x 7.87″ (250 x 200 mm) working area
- Programming allows user-defined time and temperature settings for preheat, soak, reflow, and cooling
- Unique on-board thermocouple feature allows temperature control via real-time feedback from PCB surface
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